About TBS Sorig
- In partnership with LEMAN industrie
- EloPin® License Owner
- Product Developer
- Based in Germany
- More than 20 years of experience
BENEFITS OF PRESS-FIT EloPin®
- Low pressure force and high thrust
- No tin shavings
- High mechanical stability
- Gas-tight and reliable connection
- Low mechanical stress on PCB during pressing process
- No “nozzle effect” (deformation of PCB layers from pressing)
- Temperature range from -40°C to 150°C (note 1)
- Low electrical resistance
EloPin® Sizes / Variations
| Last Name | Material thickness | PTH diameter | PCB Thickness |
|---|
| EloPin® 04-06 | 0,4 mm | 0,6 mm | 1,0 mm |
| EloPin® 06-10 | 0,6 mm | 1,0 mm | 1,44 (1,0)mm |
| EloPin® 08-145 | 0,8 mm | 1,45 mm | 1,44 mm |
| EloPin® 08-16 | 0,8 mm | 1,6 mm | 1,44 mm |
| EloPin® 12-20 | 1,2 mm | 2,0 mm | 1,44 mm |
Technical Data
| EloPin® | 04-06 | 06-10 | 08-145 | 08-16 | 12-20 |
|---|
| Pressure force | Max 100 N | 100 N | 160 N | 160 N | 200 N |
| Pressure force, Typical | 20-60 N | 65 N | 115 N | 85 N | 160 N |
| Thrust force, Min | 20 N | 30 N | 40 N | 50 N | 50 N |
| Thrust force, Typical | 35-70 N | 60 N | 135 N | 105 N | 110 N |
| Volume Resistance, Max | 1 mOhm | 1 mOhm | 1 mOhm | 1 mOhm | 1 mOhm |
| Volume Resistance, Typical | 0.05 mOhm | 0.01 mOhm | 0.01 mOhm | 0.01 mOhm | 0.01 mOhm |
| Current capacity | Not tested | Approx. 8A | Approx. 25A | Approx. 25A | Approx. 45A |
Basic materials
| Application | Mobility | Mobility | Mobility |
|---|
| Base material | CuSn6 | CuNi3SiMg | CuCrAgFeTiSi |
Electrical conductivity
Ms/m | 9 | 25 | 46 |
| Thermal Con. W/(mk) | 75 | 190 | 320 |
| Surface finish | Sn100 on Ni | Sn100 on Ni | Sn100 on Ni |
| Max. Operating temperature | 95 ° C | 150 ° C | 150 ° C |
| EloPin® 04-06 | ✔︎ | ✔︎ | |
| EloPin® 06-10 | ✔︎ | ✔︎ | |
| EloPin® 08-145 | | ✔︎ | ✔︎ |
| EloPin® 08-16 | ✔︎ | ✔︎ | |
| EloPin® 12-20 | | ✔︎ | ✔︎ |
The elopin® press-fit industrial part, developed by LEMAN Industrie, is designed to perform a specific technical function. Manufactured using advanced plastics processing, mechatronics, and multi-material integration techniques, it guarantees reliability, precision, and durability in demanding environments. It integrates into complex stamping/mechatronics advanced solutions > signal connector applications and is used particularly in the automotive market for practical applications related to performance, connectivity, or the protection of technical systems.
